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Micron Technology

Engineer, Advanced Packaging Process and Equipment Technology Development Engineering

Micron Technology
Integrated Device ManufacturingSingapore, SingaporeFull-time3 months ago
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About the role

AI summarised

This is a process and equipment engineering role in Micron's Advanced Packaging Technology Development (APTD) team, focusing on developing and enabling assembly processes for advanced packaging technologies such as wafer-level packaging and die stacking. The engineer will optimize processes, evaluate new equipment and materials, ensure quality, and collaborate with cross-functional teams to transition products from development to high-volume manufacturing.

IDMFull-timeHIG

Key Responsibilities

  • Develop and optimize assembly processes for advanced packaging technologies, including wafer-level packaging and die stacking Chip on Wafer, Chip to Wafer.
  • Focus on improving product quality, driving yield improvements, reducing costs, and enhancing productivity.
  • Establish and improve process management projects to deliver technology node requirements.
  • Evaluate and promote new equipment and materials to enhance process capabilities.
  • Set up process parameters for a variety of semiconductor equipment.
  • Evaluate, promote, and plan for new equipment and materials.
  • Ensure defense coverage through process, measurement, inspection, and testing.
  • Establish correlations between defense mechanisms to identify improvement opportunities.
  • Conduct continuous data analysis to establish advanced controls and identify improvement opportunities.
  • Work closely with internal and external partners to build and execute technology development strategies aligned with organizational and business objectives.
  • Work closely with various teams, including Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control.
  • Ensure smooth transition from new product development, qualification, small volume production to high volume production.

Requirements

  • B.S./M.S./Ph.D. (or equivalent education) in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or other related technical fields.
  • Experiences in semiconductor process and equipment will be advantageous.
  • Strong understanding of process flows, process interactions, and how process changes can affect yield, performance, and reliability.
  • Experience with design of experiment techniques (DOE), Statistical Process Control (SPC), Defect analysis and data analysis.
  • Tenacity to work effectively under timelines and limited resources.
  • Consistent track record to solve problems and address root causes.
  • Good communication skills.
  • Keen in semiconductor industry.
  • Showcase leadership potential.