About the role

AI summarised

The Principal Engineer/MTS Advanced Packaging Diffusion Process Engineering role at GlobalFoundries focuses on developing and optimizing advanced packaging unit processes such as bond/debond, die re-constitution, annealing, and TSV for multi-stack wafer and die-to-wafer integration. The position involves leading process development, equipment qualification, troubleshooting, and sustaining high-volume manufacturing through statistical methods, DOE, and lean/six sigma practices. The engineer will also mentor junior staff, drive continuous improvement initiatives, and ensure compliance with quality, safety, and reliability standards.

FoundryOnsite

Key Responsibilities

Design, execute, and analyze experiments to develop advanced packaging etch processes meeting performance, yield, reliability, and manufacturing targets
Startup and qualify new processes and equipment within scheduled timelines, working closely with equipment engineers on acceptance and tool matching
Improve process robustness for high volume manufacturing using statistical tools, DOE, data-driven decision making, and systematic problem-solving
Coach and develop other engineers on advanced packaging etch processes, facilitate CIP programs to optimize process window, cost, yield, and productivity

Requirements

BS, MS, or PhD in Electrical Engineering, Chemical Engineering, Science, Solid State Physics, or relevant engineering/physical science discipline
Relevant experience with Bonder tools (TEL W2W/BESI D2W), die re-constitution, and annealing (TEL Alpha 303, Mattson-Helios) process tools
Excellent verbal and written communication skills, strong interpersonal skills, and ability to work effectively across cultures
Proven experience leading fab-wide cross-module process development projects, conducting regular meetings with PI and UMD, delivering three improvement projects per year
Experience in cost reduction, group development, and ownership of processes and tools in manufacturing