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Qorvo

Sr Mgr, Bump/DPS & Assembly Engineering

Qorvo
Integrated Device ManufacturingSingaporeFull-time3 weeks ago
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About the role

AI summarised

Senior Manager for Bump/DPS & Assembly Engineering at Qorvo, a semiconductor company. Responsible for packaging technology development with OSAT partners, managing multiple projects from risk assessment to qualification, and leading new technology and product introduction. Requires strong problem-solving, program management, and communication skills.

IDMFull-timeManagement

Key Responsibilities

  • Early engagement & execution of a Packaging Technology development working with OSAT partner on-site aligned with cooperate roadmap to meet future Qorvo Business Unit needs
  • Could Manage multiple projects for package development from risk assessment, process /BOM establishment, qualification.
  • Lead and Manage OSAT New Technology and New Product Introduction, Qualification, HVM, in a timely and flawless manner
  • Strong problem-solving skill in Assembly engineering and leadership working with OSATs partner & cross functional team in Qorvo
  • Utilize program management methodology to plan, execute and monitor complex process and/or product development projects.
  • Strong communication, presentation skills, ability to excel in a dynamic collaborative team environment including working directly with the R&D, Quality and Product line is necessary.
  • Provide best in class industry 'know-how' to enable continued global leadership of QORVO package solutions
  • Think and act professionally in the consistent Manner as a Qorvo engineering representative of on-site OSAT
  • Manage/Coach QI's engineering resource from the daily work
  • Position will be in Singapore which have Qorvo's strategic technology development center
  • Could manage other work centers as well upon requested

Requirements

  • Bachelor's degree in Engineering or related field
  • Minimum 10 years of experience in semiconductor packaging or assembly engineering
  • At least 5 years of experience in managing OSAT relationships
  • Proven track record in new product introduction and qualification
  • Strong program management skills
  • Excellent problem-solving and analytical skills
  • Effective communication and presentation skills
  • Ability to work in a cross-functional team environment
  • Knowledge of bump, DPS, and assembly processes
  • Experience with risk assessment and process development