Qualcomm

Engineer, Senior (Technology Integration - Wafer-level Packaging)

Qualcomm
Fabless SemiconductorSingapore, Central Singapore, SingaporeOnsitePosted 4 weeks ago

About the role

AI summarised

Responsible for the end-to-end development, qualification, and mass-production transfer of new processes, materials, and manufacturing technologies in a high-volume fabrication environment. This role requires strong technical leadership to ensure process readiness, manufacturability, and a smooth ramp-up through cross-functional coordination.

FablessOnsiteHardware Engineering

Key Responsibilities

  • Define process requirements, success criteria, Design-of-Experiments (DOE), and characterization plans.
  • Drive root-cause analyses, failure mechanism studies, and improvement loops to achieve performance, yield, and reliability targets.
  • Co-own the technology transfer roadmap from pilot line to high-volume manufacturing (HVM).
  • Supervise and provide technical guidance for onsite process transfer activities, including documentation (PFMEA), training, and equipment matching.
  • Translate product requirements into detailed process specifications and control strategies.
  • Coordinate and report ramp performance tracking (yield, scrap, cycle time, tool capability) and drive gap closure.

Requirements

  • Bachelor’s or Master’s degree in Engineering (Materials, Chemical, Semiconductor, etc.).
  • 3+ years of experience in process integration engineering, technology development, or a high-volume manufacturing fab.
  • Broad exposure to wafer-level packaging technology and processes.
  • Demonstrated success leading cross-disciplinary technology integration projects.
  • Strong skills in DOE, SPC, data analytics, FMEA, and troubleshooting.
  • Excellent communication, technical documentation, and stakeholder management skills.