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Micron Technology

Front End Central Product Integration (FE cPIE) Principal Engineer/Senior Manager

Micron Technology
Integrated Device ManufacturingSingapore, SingaporeFull-time2 days ago
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About the role

AI summarised

This is a senior leadership role in Front End Central Product Integration (FE cPIE) for High Bandwidth Memory (HBM) at Micron Technology, a semiconductor memory and storage company. The Principal Engineer/Senior Manager will lead global teams to drive product yield, quality improvement, and new product introduction, collaborating with teams in Japan, Taiwan, Singapore, and the US.

IDMFull-timeFront End

Key Responsibilities

  • Work with FAB to drive for best-in-class (BIC) Yield ramping.
  • Work with key business partners to develop strategic Process Integration tools, systems, methodologies, capabilities and roadmaps.
  • Create an environment with your group that encourages innovation and technical leadership.
  • Conduct ongoing metrics reviews of critical group deliverables to business.
  • Provide direct leadership on most critical group deliverables and escalated performance items to ensure barriers are removed and correct resources are applied.
  • Provide periodical one-on-one sessions to review progress to the Work Plan and adjust training and performance goals.
  • Ensure clear direction, performance goals, job profiles and job expectations are established for all Team Members.
  • Partner with Team Members on establishing aggressive but achievable goals.
  • Drive accountability through clear communication, informal feedback, effective project management, and appropriate usage of metrics.
  • Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness.
  • Provide regular and structured communications to your team, including progress toward strategic objectives, Operations goals, priority projects, and company status.
  • Ensure structured communications with Team Members provide proper motivation and optimism toward achieving Process Integration Engineering vision and mission.

Requirements

  • Bachelors/Masters/PhD. in EE, Materials Engineering, Materials Science, Physics and Chemical Engineering
  • 7+ years of experience in process related role in semiconductor industry.
  • Ability to apply baseline digital fluency and role‑appropriate AI literacy to use AI‑enabled tools responsibly and effectively for research, analysis, content creation, problem‑solving, operational tasks, and achieving business outcomes.
  • Exhibits strong ownership, grit, and determination to drive results
  • Good logical thinking and knowledge in Semiconductor Fabrication process flows, interaction of different processes and how changes affect yield, device performance and reliability.
  • Understanding of DRAM and NAND operation and structure to decipher parametric, probe and qual data from both front end and backend assembly process.
  • Good model based problem solving together with data driven decision making, and presentation skills.
  • Proven track record to fix and tackle structure and device related issues, and address root cause.
  • Good organizational capabilities and ability to work effectively.
  • Ability to be flexible with job responsibilities and take the initiative to assume added responsibilities.
  • Travel to Micron sites as vital for face to face collaboration.
  • Strong interpersonal skills and customer/co-worker relationships.
  • Successfully demonstrated teamwork skills with a strong focus on developing good team dynamics.
  • Good multi-tasking, verbal and written communication skills.
  • Strong cross‑cultural collaboration experience in multi‑national environments
  • Travel Required: Yes. Willing to travel as needed to support department goals, travel frequency: 20-50%.