About the role
AI summarisedResearch Engineer role focused on developing next-generation semiconductor packaging processes including 2.5D/3D, FOWLP, and C2W hybrid bonding. Involves hands-on process development, characterization, and IP creation in an R&D environment.
ResearchOnsiteInstitute of Microelectronics
Key Responsibilities
- Lead the design and development of advanced assembly processes for 2.5D/3D packaging, Fan-Out Wafer-Level Packaging (FOWLP), and C2W hybrid bonding
- Coordinate and execute comprehensive evaluations of processes, equipment, and materials
- Work closely with project leaders to align on project requirements
- Develop and enhance capabilities to meet evolving project needs
- Strengthen the IP portfolio related to heterogeneous integration
- Collaborate with internal and external stakeholders to understand future demands and develop the necessary capabilities to meet these needs
Requirements
- Bachelor's or Master's degree in Materials Science, Mechanical Engineering, Physics, Chemistry, Electronics, Electrical Engineering, or a related field
- Experience in process development or packaging R&D
- Strong track record in advanced packaging technologies is an added advantage