About the role
AI summarisedThis role supports semiconductor tapeout engineering by contributing to layer generation, OPC/ORC integration, and end-to-end tapeout flows. The engineer collaborates with cross-functional teams including product, development, DevOps, and semiconductor engineering to ensure quality, consistency, and timely photomask delivery. Responsibilities include test design and execution, defect tracking, process improvement, and technical support within Agile environments.
FoundryOnsite
Key Responsibilities
- Support semiconductor mask data preparation and tapeout activities including layer generation and OPC/ORC integration
- Collaborate with cross-functional teams to support pre-tapeout design flows, frame generation, and end-to-end tapeout schedules
- Assist in problem solving, planning, and testing across tapeout and mask build flow to ensure accurate and on-time photomask delivery
- Participate in continuous improvement and automation initiatives to enhance tapeout and mask data preparation workflows
- Design and execute functional and end-to-end test cases; support System Integration Testing (SIT) and User Acceptance Testing (UAT)
Requirements
- Bachelor’s Degree in Engineering, Computer Science, Electronics, Electrical Engineering, or related technical discipline
- Experience or strong interest in semiconductor manufacturing flows, mask data preparation, or tapeout processes
- Foundational knowledge of photomask generation, OPC/ORC concepts, and pre-tapeout design flows
- Experience designing and executing functional and end-to-end tests, defect tracking, and test documentation
- Exposure to Agile or DevOps environments with understanding of sprint-based development and quality engineering practices