About the role
AI summarisedThis R&D internship at Apple focuses on Design for Manufacturing (DFM) in electronics packaging. The intern will work in a lab environment to develop innovative package designs with IP advantages, emphasizing practicality, manufacturability, quality, reliability, and cost efficiency. They will collaborate with experts to explore process technologies and evaluate designs from concept to prototyping.
TechnologyOnsiteOperations and Supply Chain
Key Responsibilities
- Develop distinctive package designs with intellectual property advantages
- Emphasize practicality in electronics packaging design
- Work alongside experts to learn various process technologies
- Tackle tough challenges in packaging design
- Work with specialists to explore highly innovative solutions
- Ensure quality, reliability, and cost efficiency in designs
- Evaluate manufacturability from initial concept to prototyping
- Contribute to lab-based development of packaging assemblies
Requirements
- Master’s or PhD in Electronics Engineering, Material Science, or related areas
- Knowledge of electronics packaging technologies
- Passion for learning and drive for innovation
- Good persuasive communication and presentation skills
- Statistical analysis capability using software like JMP or Tableau
- Knowledge in SMT, molded SiP, and wafer level packaging technologies (preferred)
- Familiarity with PCB design and fabrication technologies (preferred)
- Experience or knowledge in semiconductor failure analysis (preferred)