Infineon Technologies

Internship - Automotive Packaging Concept Conceptualization

Infineon Technologies
Integrated Device ManufacturingSingaporeOnsitePosted 2 months ago

About the role

AI summarised

This internship focuses on automotive packaging concept development, involving data analysis, visualization, and machine learning to support package design and decision-making. The role includes working with cross-functional teams in a global setting to understand packaging criteria, develop concepts, and prepare for a career in semiconductor packaging. It emphasizes hands-on experience in data-driven packaging solutions from design to ramp-up phase.

IDMOnsiteATV

Key Responsibilities

  • Understand the criteria in a package electrically, structurally, quality standard governing the application
  • Conduct in-depth analysis of large and complex datasets to extract meaningful package concept in technology & assembly for decision-making
  • Collect, clean, and organize data from various sources for analysis
  • Develop data marts, reports, dashboards, and visualization using different tools (such as excel macro, Tableau, etc)
  • Machine learning and prediction analysis for package proposal

Requirements

  • On track to attaining Bachelors in any field related to engineering studies
  • Basic technical understanding of semiconductor material /process / technology
  • Experience with complex dataset, with good analytical mindset
  • Academic exposure in programming languages with machine learning and prediction
  • Able to handle changes, take initiative to make solution proposal
  • Self motivated, highly organized, able to manage tasks independently