Jobfoundry
Jobfoundry
AMD

Technical Program Manager - External Manufacturing Operations, Backend Engineering

AMD
Fabless SemiconductorSingapore, SingaporeFull-time1 months ago
Apply Now

About the role

AI summarised

Technical Program Manager role at AMD, leading programs within External Manufacturing Operations for backend engineering, focusing on advanced packaging technologies (EFB, CoWoS, WLFO) and legacy packaging solutions. The role ensures manufacturing readiness and cross-functional alignment from NPI through ramp.

FablessFull-time{'name': 'Engineering'}

Key Responsibilities

  • APQP ownership within EMO-BE organization which shall include advanced technologies (EFB, CoWoS, WLFO) & Flip Chip BGA/LGA/chiplet NPI gate reviews on manufacturing readiness, driving cross‑functional alignment from early NPI phase through production ramp, ensuring process, quality, and performance meet program milestones.
  • Formulate, organize, coordinate, and drive interconnected programs or key initiatives with cross functional team members in accordance with the mission and goals of the organization.
  • Drive Key Program deliverables/ schedules/ budget & analyze program risk and opportunities.
  • Effectively communicate across organizations/ levels for program status update (both working details to the team, and executive summary for Executive communication).
  • Collaborate with internal engineering counterparts and extensive engagement with the Package Engineering organization, as well as cross‑functional coordination with teams such as Procurement, Supply Chain, and Reliability.
  • Drive program deliverables and providing accurate, timely program status updates and executive summaries throughout the program lifecycle.
  • Developing innovative programs to support the strategic direction of the organization.
  • Responsibilities may be adjusted or expanded based on business needs, as assigned by the supervisor.

Requirements

  • Experience in Process Integration or Product Engineering with Program Management experience.
  • Strong hands‑on experience in both Advanced Packaging (EFB, CoWoS, WLFO) and legacy packaging (Flip Chip BGA, LGA & chiplet packages).
  • Proven experience with APQP, NPI phase gates, and manufacturing readiness.
  • Experience in semiconductor engineering environment with NPI to HVM experience.
  • Strong technical communication for executive and cross‑site alignment.
  • Creative, self-driven, highly motivated individual with demonstrated ability to independently manage complex engineering tasks.
  • Strong interpersonal communication, analytical, project management, task & time management and excellent communication skills.
  • Experience in managing horizontally across multiple internal functional organizations.
  • Experience with data analytics, dashboards, or data‑driven reporting is a plus.
  • Professional fluency in English to support technical documentation, stakeholder communication, and cross‑site engineering collaboration across the region.
  • Bachelor's or Master's degree in Mechanical Engineering, Materials Science, Chemical Engineering or related engineering discipline.