Jobfoundry
Jobfoundry
Micron Technology

Package Characterization Lab Manager, APTD

Micron Technology
Integrated Device ManufacturingSingapore, SingaporeOnsitePosted 2 days ago
Apply Now

About the role

AI summarised

Manage the Package Characterization Lab within Micron’s Advanced Packaging Technology Development group, leading a shift-based team of engineers and technicians to deliver failure analysis and characterization services for cutting-edge advanced packaging technologies. Own lab operations, equipment readiness, compliance, and workforce development while partnering globally to drive innovation and support critical technical decisions.

IDMOnsiteHIG

Key Responsibilities

  • Lead Package Characterization lab operations to meet key performance metrics, cycle-time and safety standards
  • Plan and optimize FA lab equipment, space, and budget to support current and future needs with high utilization efficiency
  • Coordinate timely equipment calibration (external vendors), repairs, and spare parts procurement to ensure sustained equipment uptime
  • Evaluate and introduce new FA tool models and capabilities in partnership with vendors and Micron subject-matter experts
  • Provide technical mentorship and drive continuous improvement of package characterization methodologies and procedures
  • Collaborate cross-site to benchmark, standardize best-known methods to improve lab efficiency and effectiveness
  • Ensure FA lab readiness for new product designs and technologies
  • Align task priorities and execution with APTD team members, providing recommendations for optimal lab tool/resource usage
  • Deliver timely, clear, and actionable package analysis insights to enable data-driven technical and business decisions
  • Define, track, and review performance metrics to identify gaps, drive accountability, and build a high-performing team

Requirements

  • Bachelor’s degree or higher (Master’s/PhD preferred) in Materials Science, Physics, Chemistry, or related field
  • 8+ years of experience in semiconductor package characterization (physical/thermal/chemical) and failure analysis field
  • Knowledge of package FA tools and techniques including SEM, EDX, FIB, TEM, AFM, FTIR, XPS, X-ray, CSAM, ion milling, delayering, and decapsulation
  • Knowledge of semiconductor or advanced packaging manufacturing processes
  • Experience in lab management, shift resource planning, and budgeting
  • Proven technical leadership and people management capability
  • Strong written and verbal communication skills with a customer-focused mentality