About the role
AI summarisedThe Process Development Engineer (R&D) at Apple will conduct feasibility studies and develop new processes and materials for next-generation module technologies. Responsibilities include establishing baseline processes through proof-of-concept studies and Design of Experiments, defining CTQ metrics and required metrology, developing process equipment with vendor support, and presenting engineering reports to cross-functional teams. The role focuses on innovation in module assembly processes for Apple’s ecosystem.
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Key Responsibilities
- Conduct feasibility studies for new module technologies
- Develop new process and material development for new module technologies under research and development
- Establish new baseline processes by conducting proof of concept (POC) studies
- Define Critical-To-Quality (CTQ) metrics and their specifications
- Identify necessary metrology tools/procedures required to measure CTQs
- Develop new process equipments with support from external vendors
- Prepare and present engineering reports to cross-functional teams
- Contribute to design of next generation revolutionary Apple products
Requirements
- Degree of Science in Engineering or equivalent
- Minimum 2 to 3 years of experience in doing process R&D
- Clear and effective written and communication skills
- Hands-on experience in various module assembly processes such as flip chip, flex attach, pick and place, glue dispensing, wire bonding, filling, laser soldering, component cleaning, curing, plating, singulation, wafer bonding
- Good knowledge and hands-on experience in camera or laser projector module assembly processes with high placement accuracy requirements
- Good knowledge in design of experiment (DOE), engineering statistic, root cause analysis and problem solving
- Familiarity on different metrology tools and quantitative measurement methodology
- Knowledge of statistical analysis software (e.g. JMP or Minitab)
- Resourceful and innovative
- Knowledge and work experience in one or more of the following: Flip Chip bonding (Thermosonic, Thermocompression), EVO die bonder or any Pick & Place equipment platform, Wirebond/Studbump, Flex Attach, Glue / Solder Paste Dispensing, Solder Jetting/Laser Wire Soldering, SMT, Wire cutting & crimping
- Knowledge on adhesive or epoxy or other bonding material
- Experience in optical components, active alignment and high accuracy bonding process