About the role
AI summarisedA process engineer role at Qualcomm supporting backend wafer level manufacturing operations, focusing on tape expansion, UV curing, and taping processes. The role involves hands-on troubleshooting, process optimization, vendor management, and driving continuous improvement in a semiconductor packaging environment.
FablessFull-timeHardware Engineering
Key Responsibilities
- Lead and sustain backend processes including Tape Expansion, UV Curing and Taping.
- Perform hands-on troubleshooting of process related issues.
- Drive continuous improvement initiatives to reduce cycle time, improve yield, and lower operational costs.
- Drive permanent solutions to resolve chronic process and quality issues.
- Lead investigation for process quality escalation.
- Lead process buyoff and performance validation for new machines and technologies.
- Responsible for preparing the line for internal & external audits and follow-up actions.
- Lead cross-functional projects involving technology transfer, cost savings, and process enhancement.
- Coordinate with Technology Development and Process Integration teams for new product release / quality related matters.
Requirements
- Bachelor's Degree in Mechanical, Manufacturing, or related Engineering discipline.
- Minimum 2 years of hands-on experience in semiconductor backend packaging specifically Tape Expansion, UV Cure, Taping, Reel-to-Reel processes.
- Strong knowledge of Wafer level Taping process.
- Proficient in 5-Why Analysis, FMEA, Control Plan, OCAP, SPC, MSA, 8D report and 6 Sigma (Green Belt preferred).
- Excellent communication and interpersonal skills; able to work with cross-functional teams.
- Experience with management and controls of Wafer level Taping process.
- Familiarity with Minitab, Excel, Word and PowerPoint.
- Experience in project management is an advantage.
- Ability to work in a fast-paced, dynamic environment and adapt to changing priorities.