About the role
AI summarisedThis role involves developing SiC epitaxy processes for next-generation power devices at a leading research and innovation center. The engineer will design innovative epitaxial processes on industrial hot-wall CVD systems, perform detailed material characterization, and collaborate on advanced device technologies like trench-filling and selective epitaxy.
ResearchOnsiteInstitute of Microelectronics
Key Responsibilities
- Design and implement innovative SiC epitaxial processes on an industrial hot-wall CVD system, focusing on achieving exceptional dopant and thickness uniformity, as well as minimal extended defect density on 6- and 8-inch SiC substrates
- Perform metrology and characterization of SiC epilayers (e.g., dopant and thickness uniformity, surface roughness, crystal quality, stress, carrier lifetime, etc.)
- Conduct optical and photoluminescence inspections of extended defects in SiC epilayers, including critical defects such as micropipes, carrots, triangles, downfalls, stacking faults, and basal plane dislocations
- Design experiments to minimize point and extended defect densities in SiC, with emphasis on enhancing SiC power device performance
- Develop advanced epitaxy processes for cutting-edge devices, such as SiC selective epitaxy and SiC trench-filling epitaxy
- Prepare technical presentations and papers for internal meetings, conferences, and journals and draft technical disclosures/IP
- Collaborate with IME's NSTIC – Power team to address key technical challenges in the SiC power electronics industry
- Contribute ideation for new funding proposals
- Perform all other reasonable duties as assigned
Requirements
- Bachelor's or Master's degree in Electrical/Electronic Engineering, Materials Science, Physics, Chemistry or a related field
- 2 to 3 years of experience in semiconductor CVD process, preferrably epitaxy process development or manufacturing (Si, SiC GaN, or other semiconductor materials)
- Strong knowledge of semiconductor processes (e.g., lithography, etching) and characterization techniques (e.g., SEM, TEM, XRD)
- Excellent communication, collaboration, and self-motivation skills
- Avid technical reader, critical thinker, and strong team player
- Proficiency in data analysis and DOE tools (e.g., Excel, JMP, Origin) is an advantage