About the role
AI summarisedResearch or Senior Research Engineer role at IME's Heterogeneous Integration Department focused on advancing chip-to-wafer and wafer-to-wafer hybrid bonding processes for 2.5D/3D packaging. The position involves developing fine-pitch bonding techniques, optimizing bonding processes and materials, conducting reliability characterization, and mentoring junior researchers in a collaborative R&D environment.
ResearchOnsiteInstitute of Microelectronics
Key Responsibilities
- Research and develop advanced fine-pitch flip-chip & hybrid bonding techniques for chip-to-wafer, emphasizing bonding parameter optimization and process enhancements
- Interposer and Hybrid Bond pad fabrication for Flip Chip and Hybrid bonding applications
- Optimize Chip to wafer hybrid bonding processes, including the selection of low-temperature organic and inorganic bonding materials, surface preparation, and bonding methods
- Conduct engineering experiments for process characterization to drive quality and yield improvements
- Perform reliability characterization of flip-chip or hybrid-bonded packages to ensure robustness and long-term performance
- Lead capability development projects with manageable risks and mentor less experienced colleagues
- Collaborate with senior staff and principal investigators to develop process capability and new
- Inspire and mentor talent in semiconductor technology, contributing to workforce development in the field
Requirements
- Educational Background: Bachelors in Materials Science and Engineering, Mechanical or Chemical Engineering, Electronics, Electrical and Computer Engineering, or a related field
- Experience: 1 to 6 years of experience in microelectronic devices, circuits, and hybrid component integration, 2.5D/3D heterogenous integration applications
- Technical Expertise: Hands-on experience in flip chip bonding is preferable
- Knowledge: Knowledge of hybrid bonding equipment technologies and bonding materials and methodologies, and reliability characterization is preferable, but not mandatory
- Skills: Strong analytical and problem-solving skills. Proficiency in data analysis and interpretation and design of experiments
- Excellent written and verbal communication abilities
- Teamwork: Ability to work collaboratively in a research-oriented environment (OEMs, customers, and Internal stakeholders)
- Demonstrated ability to manage multiple tasks and projects simultaneously
- Demonstrated expertise in heterogeneous integration, hybrid bonding, and advanced packaging processes