About the role
AI summarisedAs a Principal Process Engineer in Advanced Packaging at ASM, you will lead the research, development, and optimization of semiconductor processes including thin-film deposition and surface preparation for next-generation packaging technologies. You will design and execute experiments, mentor junior engineers, collaborate with customers and internal teams, troubleshoot equipment, and contribute to technical publications and intellectual property. This role requires deep expertise in ALD, CVD, PECVD, advanced materials and electrical characterization, and hands-on experience with hybrid bonding and advanced packaging integration.
EquipmentOnsiteProcess development
Key Responsibilities
- Research, develop, and optimize semiconductor processes focused on Advanced Packaging including depositions (ALD, PECVD, PVD, ECP) and surface preparation
- Design and conduct complex experiments using DOE and RSM methodologies; interpret and analyze experimental data
- Develop new films or processes for emerging packaging applications like W2W/D2W Hybrid bonding and perform advanced materials characterization
- Provide mentorship to Process Engineers and lead technical problem-solving sessions using scientific methods and tools such as Ishikawa diagrams
- Collaborate with customers and marketing teams to define requirements and execute demonstrations
- Draft technical papers, generate Intellectual Property, and present findings to professional audiences
- Travel up to 10% to support remote sites and customer engagements
- May supervise process engineering technicians and provide input on performance evaluations
Requirements
- Master’s or PhD in Chemical Engineering, Materials Science, Electrical Engineering, or Physics
- 10+ years of combined education, research, and work experience in thin-film deposition (ALD, CVD, PECVD) and advanced packaging processes
- Proficiency in materials characterization techniques (XPS, SIMS, RBS, AFM, XRR, XRD, TEM, SEM, ellipsometry)
- Knowledge of electrical characterization techniques for CMOS devices
- Ability to manage complex process development projects, including schedules, budgets, and personnel
- Expertise in integration advanced packaging process flows like CoWoS, SoIC, InFO
- Direct experience working on D2W/W2W Hybrid bonding including surface preparation steps
- Experience in contributing Process and equipment qualification data towards a full Semiconductor equipment PLC process
- Experience with advanced metrology/Inspection characterization techniques
- Strong communication skills to convey technical concepts clearly