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Micron Technology

Engineering Project Manager - APTD Operations

Micron Technology
Integrated Device ManufacturingSingapore, SingaporeFull-time1 months ago
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About the role

AI summarised

Engineering Project Manager role in APTD Operations at Micron Technology, a semiconductor memory and storage solutions company. The role involves leading technology development programs, managing engineering builds, and coordinating cross-functional teams to deliver projects on time. Requires 3-5+ years of semiconductor manufacturing experience, preferably with HBM exposure, and a degree in engineering.

IDMFull-timeHIG

Key Responsibilities

  • Lead technology development programs and projects to deliver against defined go-to-market timelines.
  • Align program- and project-level plans, dependencies, and deliverables to ensure timely, cohesive execution.
  • Develop and maintain integrated project schedules in collaboration with cross-functional teams.
  • Ensure all deliverables and artifacts meet program requirements and align with established business processes.
  • Proactively identify and resolve risks, issues, and roadblocks, escalate as needed to protect timelines.
  • Facilitate regular project reviews and meetings to track progress and address challenges.
  • Monitor and communicate project status and overall program health to stakeholders.
  • Centralize and manage project documentation and data using SharePoint and Confluence.
  • Continuously improve technology development processes, tools, and systems to drive execution efficiency.
  • Handle technology development and engineering builds in partnership with internal and external teams.
  • Define and execute build plans, priorities, milestones, and schedules with cross-functional stakeholders.
  • Forecast build, material, cost, and resource requirements, maintaining accurate planning data and tools.

Requirements

  • Bachelor's or master's degree or equivalent experience in Materials, Mechanical, Chemical, or Electrical/Electronic Engineering.
  • 3-5+ years' experience in Semiconductor Frontend/Backend Manufacturing, preferably minimum 1 year of HBM experience.
  • Experience in Project/Process Integration, Project/Program Management, Technology Development, Operations Management, or Process Engineering.
  • Solid understanding of advanced packaging flows.
  • Proficiency in essential computer applications, including Excel, Word, statistical tools, Confluence, Power BI, and Power Apps.
  • Knowledge of SAP, Teamcenter and manufacturing execution systems.
  • Knowledge of Project Management Tools/Systems.
  • Strong analytical and problem-solving capabilities.
  • Outstanding communication, leadership, and stakeholder management skills.
  • Ability to work independently and collaboratively in a fast-paced environment.
  • Demonstrated excellence in leading teams within a global manufacturing network composed of members from diverse fields and cultures.