Micron Technology

Senior/ Staff STPG NAND Product Development Engineer – Test Chip Vehicle

Micron Technology
Integrated Device ManufacturingSingapore, SingaporeFull-time3 weeks ago

About the role

AI summarised

Senior individual contributor in Micron's STPG group responsible for technical leadership across the full learning loop of NAND flash test chip vehicles (TCV), including pre-silicon simulation and regression strategy, silicon debug, and data-driven design improvements. The role requires deep expertise in semiconductor devices, memory circuits, and data analysis to drive cross-functional technical direction.

IDMFull-timeSTPG

Key Responsibilities

  • Own pre-silicon validation strategy for TCV, partnering with Design, Process, and TD to define what must be proven in simulation versus silicon.
  • Develop, maintain, and execute robust simulation and regression frameworks (functional, parametric, stress, and corner) aligned to TCV objectives.
  • Define coverage expectations and exit criteria for pre-silicon regressions, identifying gaps and latent risks early.
  • Analyze simulation results to surface architecture, device, and margin sensitivities, driving design updates and tape-out readiness decisions.
  • Establish and enforce simulation ↔ silicon correlation methodology to ensure modeling fidelity and learning continuity.
  • Provide technical ownership for TCV bring-up from first silicon through full characterization readiness.
  • Define probe enablement, trims, operating conditions, and debug strategies to accelerate stable and informative silicon access.
  • Lead execution of electrical characterization plans validating array, periphery and experimental features against design and process intent.
  • Drive deep root cause analysis for silicon anomalies, distinguishing design, process, model, or test limitations.
  • Architect TCV specific test modes, patterns, and flows to maximize learning efficiency and data quality.
  • Partner with Test Solutions Engineering (TSE) to influence probe architecture and infrastructure supporting TCV for protocol evolution.
  • Define voltage, timing, and temperature stress strategies to expose true design and process limits beyond nominal behavior.

Requirements

  • Bachelor's or post-graduate degree in Electrical/ Electronics/ Computer Engineering or related field, with minimum 5 years of relevant industrial experience.
  • Strong fundamentals in CMOS/ MOSFET device physics, memory circuits, and semiconductor devices.
  • Demonstrated experience owning pre-silicon simulation/regression and post-silicon test/ validation for complex designs.
  • Strong capability in data analysis and scripting (Python, JMP, or equivalent) applied to large datasets.
  • Proven ability to drive ambiguous technical problems to closure with minimal supervision.
  • Deep experience with NAND Flash architectures, array/periphery interactions, and test chips is preferred.
  • Working knowledge of DFT, probe test infrastructure, and failure analysis.
  • Experience with firmware-assisted test modes and experimental silicon features.
  • Exposure to automation, ML/AI, or advanced analytics applied to simulation and silicon learning loops.
  • Candidates may be considered for higher job grades if they exceed 10 years of relevant experience.