About the role
AI summarisedThis is a senior-level MTS Advanced Packaging Technology Development Integrator role at Micron, a semiconductor memory and storage company. The position involves developing advanced packaging process solutions, leading new technology node readiness, and improving yield, quality, and reliability through process characterization and optimization.
IDMFull-timeHIG
Key Responsibilities
- Ensure smooth transition from new process development, 1st qualification success to small volume production launch
- Development and Qualification of new packaging process, material, equipment and technology solutions to meet new Technode requirements and schedule
- Perform CPI NUDD, process TRA, risk mitigation execution and process recipe readiness prior Silicon arrives and ensure 1st pass rate.
- Qualify new process/technology/equipment/materials
- Identify path finding opportunities for Micron's technology leadership with BIC time to market, continuous yield improvement, cost efficiency & touchpoint optimizations
- To understand and be able to integrate process knowledge between upstream and downstream across Si and assembly/packaging process
- Understand the future trend, technology and capabilities required for future packaging solutions, work with teams to put in place new capabilities to enhance process performance.
- Provide new solutions on time to meet company and customer needs
- Define, develop and establish process capabilities, strategy and roadmap
- To develop & engage creative solutions for new capabilities or to overcome the identified process constraints, ahead product requirements.
Requirements
- PhD/Masters/Bachelor's Degree in Electrical & Electronic, Material, Mechanical Engineering, Physics & Applied Physics or Equivalent Work Experience Required
- 10 years' and/or above experience in semiconductor industry, preferably in R&D or technology development or failure analysis field, with strong expertise in failure analysis methodologies and techniques.
- Experience in DRAM/ NAND technology
- Experience in Frontend fab Process integration or Module process
- Experience in Backend advance packaging wafer/ die level process or integration
- Experience in temporary/ permanent bonding technology (Wafer on wafer, Chip on wafer)
- Understanding of silicon integration and how it interacts at backend process & package level through CPI
- Proficiency with simulation tools and data analytics platforms for performance analysis and optimization
- Technical journals or patents being published internally/ externally
- Strong project management skills to ensure execution to timelines
- Strong communication and presentation skills
- Understanding of business needs and customers' requirement
- Ability to integrate & cooperate with people from cross function teams