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Micron Technology

Front End Central Product Integration - Chip Interaction Senior Engineer/Engineer

Micron Technology
Integrated Device ManufacturingSingapore, SingaporeOnsitePosted 4 months ago
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About the role

AI summarised

The Front End Central Product Integration Engineer-Chip Package Interaction role at Micron Technology focuses on driving silicon node packaging product yield, quality improvement, and new product introduction through technical expertise, cross-functional collaboration, and project execution. The position involves leading process improvement initiatives, maintaining technical expertise in packaging and front-end interactions, and supporting global fab operations with periodic travel. Responsibilities include managing global projects, defining packaging technology strategies, leading yield optimization taskforces, and communicating results to stakeholders.

IDMOnsiteFront End

Key Responsibilities

  • Promote worldwide synergy for improved benchmark performance and efficiency gains through global project management and execution, network BKM leveraging and enhancement, and business process creation and re-engineering
  • Lead the PI Loop taskforce and/or team in network to address yield and quality challenges, optimize process flow in a timely manner to achieve BIC yield performance
  • Communicate and respond to issues in a timely manner.
  • Help drive to fix the issue where necessary
  • Periodically follow up with manager to ensure all type of goals are met and get assistance to remove obstacles
  • Travel to Micron Fab locations as necessary for face-to-face work

Requirements

  • Bachelor’s or Master's degree in Electrical Engineering, Microelectronics, Physics, Chemistry, Material Science Engineering or related field
  • A minimum of 2 years of experience in Back-End-of-Line (BEOL) semiconductor processing or process integration is required
  • Must be willing to travel as needed to support departmental goals, with an expected travel frequency of approximately 20–50%
  • Knowledge in Semiconductor Device Physics, DRAM operations, wafer fabrication process flows, parametric/electrical test and probe yield
  • The experience on DRAM HPM, BEOL integration, advanced packaging and layout will be a plus to this job position
  • Good data analysis, troubleshoot, problem solving, reporting and presentation skills with a strong attention to detail
  • Good multi-tasking, verbal, and written communication skills
  • Strong interpersonal skills and customer/co-worker relationships. Successfully demonstrated teamwork skills with a strong focus on developing good team dynamics
  • Good organizational capabilities and ability to work effectively with minimal supervision
  • Intermediate to advanced PC skills including Microsoft Office
  • Ability to be flexible with job responsibilities and take the initiative to assume added responsibilities