About the role
AI summarisedThis role is for a Distinguished Member of Technical Staff leading NAND Advanced Thin Films Process Development at Micron. The individual will drive innovation in ALD/CVD processes, materials integration, and yield enhancement for next-generation memory technologies. They will mentor senior leaders, represent Micron externally, and shape technology roadmaps through deep expertise in film deposition, characterization, and failure analysis.
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Key Responsibilities
- Address and solve the most challenging technical problems, guiding teams in comprehensive root cause analysis and resolution
- Represent Micron at industry consortia, technical conferences, and through participation in collaborative research initiatives
- Develop and advocate for strategies focused on cost savings, process efficiency, and large-scale yield enhancement
- Own and update the structural and electric film process technology roadmap, aligning with business objectives and competitive benchmarks
- Initiate and lead strategic collaborations with external partners, universities, and research institutes
- Prepare and deliver high-impact technical presentations, white papers, and patent filings
- Assess technical risks and make informed decisions on process development priorities and technology investments
Requirements
- PhD or equivalent in Materials Science, Chemical Engineering, Physics, Chemistry, Electrical Engineering, or a related field
- Over 20 years of experience in Thin Film research and development for NAND process specifically Diffusion, CVD, dielectric and carbon-based Films
- Industry recognition: patents, publications, invited talks, and leadership roles in technical committees or consortia
- Mastery of ALD/CVD (plasma and thermal) processes: Pioneering new deposition methods, materials, and integration strategies for innovative NAND scaling
- Deep expertise in reliability modeling, process-device correlation frameworks, and advanced failure analysis across multiple technology generations
- Authority in breakthrough innovation, cross-disciplinary leadership, and external technology benchmarking; influential in shaping industry standards
- Expert in advanced characterization: SIMS, XPS, TEM, EELS, APT, ML-assisted image analysis for HAR structures and defect mapping
- Leads the conception, development, and implementation of disruptive chemistries, materials, and hardware solutions for next-generation NAND