About the role
AI summarisedThe Sr Mgr leads packaging technology development and assembly engineering initiatives, collaborating with OSAT partners and internal teams to drive new product introductions and high‑volume manufacturing.
IDMOnsiteManagement
Key Responsibilities
- Applicants will receive fair and impartial consideration without regard to any characteristics protected by applicable law, including race, color, religion, sex (as defined by law), national origin, age, military or veteran status, genetic information, or disability.
Requirements
- Bachelor’s or master’s degree in mechanical engineering, Material Science engineering or a related field with a minimum of 10 years in semiconductor packaging or assembly engineering industry Good communication skill with open minded to learn semiconductor area: Bumping, DPS and Assembly process Good attitude, detail-orientated, proactive, quick learner and able to work effectively in a fast-paced environment Proven strong interpersonal and communication skills with willingness to take accountability Ability to address internal and external customer complaints and do multi-tasking Ability to lead cross-functional teams and drive supplier performance Location of hiring is based in Singapore and no travel limit up to 6 months #LI-MC1 MAKE A DIFFERENCE AT QORVO We are Qorvo.
- It starts with our employees.
- As a unified global team, we bring a commitment to excellence, growth and a passion for creating what's next.