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Broadcom

Staff Packaging SI Engineer

Broadcom
Fabless SemiconductorSingapore-YishunFull-time1 months ago
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About the role

AI summarised

Staff Packaging Signal Integrity Engineer at a semiconductor company, responsible for electromagnetic extraction and signal integrity simulation of IC packages and PCBs, working closely with design teams to optimize electrical performance.

FablessFull-timeGeneral

Key Responsibilities

  • Perform electromagnetic extractions on interconnects in IC Packages and PCBs, using tools such as Ansys HFSS, Q3D, SIWave, etc.
  • Perform signal integrity circuit simulations on parallel digital interfaces such as DDR, analog SerDes channels and Power Delivery Networks (PDN), using tools such as ADS, Ansys Designer or HSpice.
  • Work closely with IC Package Design engineers for electrical design optimization of Packaging Interconnects and PDN
  • Work closely with IP owners, chip leads, package and PCB design engineers to optimize Bump/Ball maps of IPs and SoCs and to verify that the package electrical performance meets intended system impact targets
  • Perform frequency and time domain lab measurements on silicon die, bare substrates, PCBs and systems, often using micro probe stations
  • Contribute to the documentation of the simulation / extraction flows and Design Guidelines
  • Interface with substrate and assembly suppliers through the packaging team, to help drive packaging technology improvement for electrical performance, such as 2.5D Integration and Substrates for high-speed applications

Requirements

  • MS in EE with 6+ years of experience or Ph.D. in EE with 3+ years of experience or BS in EE with 8+ years of experience in Signal Integrity / Power Integrity Analysis and Interconnect Design Optimization for Electrical Performance
  • Solid knowledge in Interconnect Electromagnetics, Transmission Line Theory and Circuit Theory
  • Power user of Ansys HFSS, Q3D, SIWave and/or Cadence Sigrity Power SI
  • Power user of Ansys Designer, HSpice or Agilent ADS
  • Working knowledge of Cadence APD and AutoCAD
  • Hands-on lab measurement experience with VNA, TDR System & Oscilloscopes, preferably with micro-probe stations
  • Strong communication, analytical and organizational skills; attention to details in engineering analysis and project management