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Micron Technology

Staff/Senior Engineer -Package Health System and Analytics

Micron Technology
Integrated Device ManufacturingSingapore, SingaporeOnsitePosted 4 weeks ago
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About the role

AI summarised

The Staff/Senior Engineer - Package Health System and Analytics role at Micron focuses on developing and executing package health monitoring, simulation, and characterization activities. The position involves hands-on engineering work in DFT, data analysis, and reliability testing to ensure robust packaging solutions. Responsibilities include defining package health metrics, implementing real-time defect detection, performing correlation studies, building knowledge bases, and establishing end-to-end traceability across wafer, assembly, and test stages.

IDMOnsite

Key Responsibilities

  • Define quantitative package health metrics
  • Develop detection mechanisms and monitoring dashboards for continuous health assessment
  • Perform electrical and mechanical characterization of packages
  • Implement real-time defect detection and classification (critical vs. non-critical)
  • Conduct next-level characterization for critical defects and integrate findings into predictive models
  • Perform correlation and causation studies between process variables, defect patterns, and reliability outcomes
  • Collaborate with process and equipment engineers to establish traceability across wafer, assembly, and test stages
  • Develop data pipelines and tools for linking process parameters, equipment signals, and defect signatures

Requirements

  • Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, or related field
  • 3+ years of experience in semiconductor industry (complex products preferred), preferably in packaging, test, or reliability engineering
  • Strong data analytics and statistical modeling skills
  • Proficiency in Python/R for data analysis and visualization
  • Strong understanding of semiconductor packaging process, material interaction and properties
  • Ability to work cross-functionally with process, equipment, and reliability teams
  • Experience with AI/ML tools or statistical modeling
  • Knowledge of defect inspection systems and inline metrology
  • Familiarity with advanced packaging technologies (HBM, hybrid bonding, 2.5D/3D stacking)
  • Strong problem-solving and documentation skills