Micron Technology

Principal/Staff Engineer, PCVD Film Deposition, TD

Micron Technology
Integrated Device ManufacturingSingapore, SingaporeFull-time3 months ago

About the role

AI summarised

Principal/Staff Engineer for PCVD film deposition process development in semiconductor technology development. The role involves developing advanced thin film deposition processes (ALD, LPCVD, PECVD, PVD) for next-generation memory, designing experiments, performing root-cause analysis, and collaborating with cross-functional teams. Requires deep expertise in deposition techniques, characterization, and data analytics.

IDMFull-timeSTPG

Key Responsibilities

  • Develop and optimize advanced thin film deposition processes (ALD, LPCVD, PECVD, PVD) for cutting-edge device architectures
  • Design and execute complex DOE experiments to improve process capability, uniformity, and reliability
  • Perform in-depth root-cause analysis using advanced modeling and characterization techniques
  • Collaborate with integration, other process areas, metrology, and equipment engineering teams to solve critical technical challenges
  • Drive innovation in film deposition for improved performance, cost efficiency, and sustainability
  • Utilize advanced data analytics and modeling to predict process behavior and accelerate development cycles
  • Define technology roadmaps and lead strategic research initiatives. Generate intellectual property and influence future deposition technology directions
  • Mentor junior engineers and lead multi-disciplinary technical projects

Requirements

  • Ph.D/Master's in Chemical Engineering, Materials Science, Electrical Engineering, Physics, or related field
  • Master with minimum 8 years or PhD with minimum 5 years hands-on experience in advanced thin film deposition, characterization or related semiconductor field
  • Expertise in ALD, LPCVD, PECVD, and PVD for advanced nodes
  • Strong understanding of film growth mechanisms, surface chemistry, and plasma physics
  • Knowledge of thermodynamics, chemical kinetics, and reaction engineering
  • Proficiency in DOE, SPC, and advanced statistical analysis
  • Some familiarity with TCAD or process simulation tools for film modeling
  • Data analytics and machine learning for process optimization
  • Hands-on experience with TEM, SEM, XPS, SIMS, XRD, AFM, ellipsometry, and other thin film metrology
  • Advanced root-cause analysis and failure mode identification
  • Ability to develop predictive models for process behavior