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Micron Technology

Principal/Staff Engineer, Process Integration, NTI NAND

Micron Technology
Integrated Device ManufacturingSingapore, SingaporeFull-time2 weeks ago
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About the role

AI summarised

Principal/Staff Engineer for Process Integration in NTI NAND at Micron, a semiconductor company. The role involves leading process modules for 3D NAND technology development, defining specifications, optimizing performance, and coordinating cross-functional teams. Requires deep expertise in NAND process integration and at least 5 years of experience in wafer fabrication.

IDMFull-timeSTPG

Key Responsibilities

  • Lead one or more process modules related to the development and operation of 3D NAND semiconductor coordinated circuits.
  • Define structural specifications and process requirements for assigned modules.
  • Set a clear direction and vision for the module and establish a continual improvement plan.
  • Identify potential structure, electrical, and reliability issues early and address them with process control. Solve problems using a model-based approach.
  • Focus on structural development, electrical performance, parametric verification, and process control. Optimize manufacturability assessments.
  • Analyze materials physically and electrically. Collaborate with process groups to select new materials for development and transition them from research to production.
  • Build and complete device and process experiments. Extract, analyze, report, and draw conclusions on experiments and clarify the statistical significance of the data.
  • Assemble and coordinate a development team, including process engineers, to drive module development.
  • Make key decisions and provide clear direction, goals, and metrics for team success.
  • Innovate to address complex problems and consider new options for improving and developing new technologies. Regularly submit patent disclosures.
  • Coordinate activities across cross-functional teams to enable rapid and low-error project progression.
  • Support the transfer of new technology from R&D to high-volume manufacturing.

Requirements

  • Passionate about semiconductor technology and innovation.
  • Adept at data analysis, problem-solving, and process integration optimization.
  • Excellent communication skills and capacity to collaborate within cross-functional teams.
  • Proficiency in scripting/programming/engineering/business intelligence/Analytics software, such as Python, SolidWorks, Tableau, Power BI, etc., is desirable.
  • Minimum of 5 years of experience in Wafer Fabrication Process Development in Dry Etch, Photolithography, Films, Wet Process, CMP or Process Integration.
  • Strong complete understanding of PI modules on new NAND technologies and related structural & electrical fail mechanisms.
  • In-depth knowledge and direct experience with non-volatile memories (NAND) and understanding of the NAND process flow, interaction of process & device, and common yield & reliability issues.
  • Experience in R&D and technology transfer to manufacturing.
  • Committed to quality, collaboration, and continuous improvement.
  • Self-motivated with a proven ability to work in a fast-paced & dynamic environment.
  • Masters/PhD in Electrical Engineering, Microelectronics, Chemical Engineering, Material Science, or a related field, or equivalent experience.