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Micron Technology

Package Silicon Technology Node Development Director/DMTS

Micron Technology
Integrated Device ManufacturingSingapore, SingaporeFull-time1 months ago
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About the role

AI summarised

Director/DMTS role at Micron Technology focusing on technical leadership in chip-package interaction technology roadmaps for advanced silicon node transitions in memory products. Collaborates with cross-functional teams across fab, design, and quality to ensure successful product launches.

IDMFull-timeAssembly & Test

Key Responsibilities

  • Leading global technical silicon teams
  • Develop and communicate silicon technology roadmaps and working closely with multiple fab sites on advanced memory technology transitions
  • Collaborate with engineering teams in fab process integration, assembly design and development, product design and development engineering teams to establish CPI risk mitigation strategies
  • Regularly align priorities, timelines, and resource needs with management and stakeholders to keep silicon technology and test vehicles working seamlessly with design & process requirements

Requirements

  • Good understanding and experience with process technology development business processes and strategy.
  • Understanding of memory technologies and processing preferred
  • Expertise in chip-package-interaction failure mechanisms and risk assessments
  • Demonstrated ability to form collaborations (internal and external) and internal customers.
  • Ability to work on multiple projects and work through cross-disciplinary and cross-organizational issues.
  • Strong presentation skills and experience.
  • Strong relationship building and matrix management skills.
  • Proven ability to solicit feedback, accept input, and analyze success/failure of self and team.
  • Master's or Phd degree or higher in Materials Science/Engineering, Chemical Engineering, Electrical Engineering, Physics, Chemistry or a similar field is preferred.
  • 15+ years of proven experience in related fields
  • Experience with chip package interactions, semiconductor electrical/physical failure mechanisms, failure analysis, testing/screening methods, and reliability testing
  • Documented record of technical expertise and innovation resulting in high impact results; publications, patents; and track record of technical leadership and mentoring.
  • Excellent communication skills with the ability to convey sophisticated technical concepts to both technical and non-technical partners.