About the role
AI summarisedAs a Dry Etch MTS/Principal Engineer in Process Development for Advanced NAND at Micron, you will lead the development and innovation of dry etch processes for next-generation NAND technology. You will collaborate with cross-functional teams to solve complex structural problems, develop technology roadmaps, and mentor peers in dry etch technology. The role requires strong expertise in plasma physics, process control, and NAND module development, with a focus on transferring R&D processes to manufacturing.
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Key Responsibilities
- Develop and innovate dry etch processes to meet structural and electrical specifications
- Collaborate and lead cross-functional teams to solve complex structural problems
- Present process and technology roadmaps for current and upcoming technology nodes
- Work on critical modules such as HAR, Tier by tier etches, WL contacts, and staircase
- Find opportunities and drive towards collaborative solutions with other process areas
- Direct technology roadmaps for other process areas
- Lead or participate in cross-functional task force groups targeting specific goals
- Act as a resource and mentor for peers in dry etch technology and project management
- Provide critical updates to upper management on project status and impacts
Requirements
- Demonstrated interest in working within a research and development environment
- 3-10 years of experience in dry etch process development within R&D transferring to manufacturing
- 2-3 years of applicable NAND, DRAM, or Logic module development experience
- Knowledge of plasma physics, plasma chemistry, transport, or surface phenomena
- Demonstrated leadership in problem-solving and managing technical projects
- Understanding of various types of plasma dry etch reactors
- Expertise in statistical process control and analysis
- Experience solving scalability problems of deep high aspect ratio silicon/dielectric etches
- Ability to lead supplier head-to-heads
- Preferred experience in data science basics, Python coding, or AI coding
- Strong computer skills, including MS Office and SAS software like JmP
- MS/PhD in Chemical, Mechanical, Electrical, Material Science, Physics, Molecular Physics, Physical Chemistry, Semiconductor Technology, or related fields with 4-10 years of practical experience in dry etch process development
- BS in Chemical, Mechanical, Electrical Engineering, Materials Engineering, Physics, Chemical Physics, Chemistry, Semiconductor Engineering, or similar fields with 7-12 years of pertinent experience