Micron Technology

Senior Manager/ Manager, Advanced Packaging Technology Development - Package Integration

Micron Technology
Integrated Device ManufacturingSingapore, SingaporeOnsitePosted 6 months ago

About the role

AI summarised

The Senior Manager/Manager of Advanced Packaging Technology Development leads the package integration team to drive the development and deployment of advanced packaging solutions for high-performance memory products. This role involves setting technical strategy, providing cross-functional leadership, ensuring project execution and quality, and mentoring engineers. The position requires deep expertise in semiconductor packaging, data analytics, and team management within a technology development environment.

IDMOnsite

Key Responsibilities

  • Develop and communicate Advanced Packaging Technology Development strategic objectives
  • Understand the impact and implications of APTD strategy to the overall company strategy and direction
  • Provide technical leadership that may influence company direction
  • Represent APTD in providing cross-department leadership in area of responsibility
  • Work effectively with peers in other departments to develop and drive multi-functional initiatives
  • Ensure accuracy, quality, and timeliness of results
  • Guide best utilization of resources to achieve end results
  • Ensure critical work, milestones and goals are met by the team
  • Seek out opportunities to work multi-functionally, build a network, and gain competency across domains

Requirements

  • B.S/M.S./Ph.D. (or equivalent education) in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or other related technical fields
  • 8 or more years of semiconductor process or equipment engineering experience, preferably in wafer bonding, plating, warpage control and packaging field, preferably in Technology Development
  • Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics
  • Experience with Visual Basic for automation and tool integration
  • Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control
  • Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding
  • Experience in equipment development with fundamental understanding of post probe and assembly process and equipment interactions
  • Strong understanding of process flows, process interactions, and how process changes can affect yield, performance, and reliability
  • Consistent track record to solve problems and address root causes
  • Ability to multi-task and manage numerous projects simultaneously
  • Tenacity to work effectively under timelines and limited resources
  • Validated ability to lead small and large teams, directly or indirectly, toward common goals
  • Outstanding communication and presentation skills, written and verbal to all levels of an organization