Jobfoundry
Jobfoundry
Micron Technology

Principal/Senior Engineer, APTD CEM - Advanced Packaging Integration Engineering

Micron Technology
Integrated Device ManufacturingSingapore, SingaporeFull-time5 months ago
Apply Now

About the role

AI summarised

Senior/Principal Engineer for Advanced Packaging Integration at Micron's APTD team, focusing on developing and enabling advanced packaging technologies for high-performance memory products like HBM. Responsibilities include technology development, yield improvement, quality improvement, and cross-functional collaboration. Requires BS/MS/PhD in engineering or physics, 2+ years semiconductor process integration experience, and proficiency in data analytics tools.

IDMFull-timeHIG

Key Responsibilities

  • Develop and enable advanced package technology for various post-fab wafer finish and assembly processes
  • Focus on improving product quality, driving yield improvements, reducing costs, and enhancing productivity
  • Integrate semiconductors while partnering with process and product engineering teams
  • Achieve and improve yields through silicon package integration innovation, not limited to layout/design or process margin improvements
  • Collect and analyze data to provide actionable outcomes and decisions for layout, design, or integration flow changes
  • Work with Probe, Yield Analysis, Test, and Product Engineering teams to drive improvements
  • Ensure defense coverage through process, measurement, inspection, and testing
  • Establish correlations between defense mechanisms to identify improvement opportunities
  • Conduct continuous data analysis to establish advanced controls and identify improvement opportunities
  • Work closely with internal and external stakeholders to build and execute technology development strategies aligned with organizational and business objectives
  • Work closely with various teams, including the PWF Engineering, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control
  • Ensure smooth transition from new product development, qualification, small volume production to high volume production

Requirements

  • B.S/M.S./Ph.D. (or equivalent education) in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Physics, Material, or other related technical fields
  • 2 or more years of semiconductor process integration experience, preferably with know-how to develop and enable advanced package technology for post-fab wafer finish and assembly processes
  • Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics.
  • Experience with Visual Basic for automation and tool integration.
  • Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control.
  • Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding.
  • Strong understanding of process flows, process interactions, and ability to integrate semiconductors while partnering with process and product engineering team
  • Ability to resolve complex issues through root-cause or model-based problem solving
  • Tenacity to work effectively under timelines and limited resources
  • Consistent track record to solve problems and address root causes