About the role

AI summarised

The Snr/Staff Equipment Development Engineer (APTD) at Micron is responsible for developing and optimizing advanced packaging equipment, establishing hardware roadmaps, and driving innovation in wafer-level packaging and stacking technologies. This role involves cross-functional collaboration with process development, product engineering, and quality teams to ensure equipment readiness from development through high-volume production. The position requires strong analytical skills, experience in semiconductor equipment development, and proficiency in data analytics tools to support process improvement and equipment maturity.

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Key Responsibilities

Develop and optimize advanced packaging equipment for technology enablement, including wafer-level packaging and stacking
Focus on improving equipment capability, enabling process improvements, reducing costs, and enhancing productivity
Establish and improve equipment management projects to deliver tech node requirements
Evaluate and promote new equipment and materials to enhance process capabilities
Developing wafer and assembly equipment to meet the physical and electrical requirements of Micron’s products, cost, availability, and improve hardware and process capability
Ensure defense coverage through process, measurement, inspection, and testing
Establish correlations between defense mechanisms to identify improvement opportunities
Conduct continuous data analysis to establish advanced controls and identify improvement opportunities with SMAI team
Collaborating with process development teams to develop innovative new solutions
Performing fundamental research to drive innovative solutions for next-generation equipment products

Requirements

B.S/M.S./Ph. D. (or equivalent education) in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or other related technical fields
5 or more years of semiconductor process or equipment engineering experience, preferably in wafer bonding, plating, warpage control and packaging field stacking process equipment TC bonder/ Hybrid Bonder
Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics is preferred
Experience with Visual Basic for automation and tool integration
Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control
Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding
Experience in equipment development with fundamental understanding to execute to improve equipment maturity for First of a Kind (FOAK) hardware
Experience in wafer bonding, plating, warpage control and packaging process development and understanding of related inline/electrical/probe failure
Knowledge of semiconductor processing, solid-state device physics desirable
Consistent track record to solve problems and address root causes