About the role
AI summarisedSenior/Staff/Principal Advanced Packaging Technology Development Integrator at Micron, responsible for developing advanced packaging process solutions, leading new technology node readiness, and improving yield, quality, and reliability. The role involves process characterization, optimization, and collaboration with cross-functional teams to resolve process-related problems and ensure smooth transition from development to production.
IDMFull-timeHIG
Key Responsibilities
- Development and Qualification of new packaging process, material, equipment and technology solutions to meet new Technode requirements and schedule
- Perform CPI NUDD, process TRA, risk mitigation execution and process recipe readiness prior Silicon arrives and ensure 1st pass rate
- Qualify new process/technology/equipment/materials
- Identify path finding opportunities for Micron's technology leadership with BIC time to market, continuous yield improvement, cost efficiency & touchpoint optimizations
- To understand and be able to integrate process knowledge between upstream and downstream across Si and assembly/packaging process
- Understand the future trend, technology and capabilities required for future packaging solutions, work with teams to put in place new capabilities to enhance process performance
- Provide new solutions on time to meet company and customer needs
- Define, develop and establish process capabilities, strategy and roadmap
- To develop & engage creative solutions for new capabilities or to overcome the identified process constraints, ahead product requirements
Requirements
- PhD/Masters/Bachelor's Degree in Electrical & Electronic, Material, Mechanical Engineering, Physics & Applied Physics or Equivalent Work Experience Required
- 6 years' and/or above experience in semiconductor industry
- Experience in Frontend fab Process integration or Module process
- Experience in Backend advance packaging wafer/ die level process or integration
- Understanding of silicon integration and how it interacts at backend process & package level through CPI
- Proficiency with simulation tools and data analytics platforms for performance analysis and optimization
- Experience in temporary/ permanent bonding technology (Wafer on wafer, Chip on wafer) is a plus
- Strong project management skills to ensure execution to timelines
- Strong communication and presentation skills
- Understanding of business needs and customers' requirement
- Ability to integrate & cooperate with people from cross function teams