About the role
AI summarisedWe are seeking a highly skilled multi-physics modelling and Process Design Kit (PDK) development engineer to join our team. The ideal candidate will have a strong background in Electrical or Computer Engineering (PhD), focusing on converting 2.5D/3D/3.5D chiplet based System in Package design and integration needs into advanced packaging PDK interconnect models, co-simulation frameworks, and reference flows.
ResearchOnsiteInstitute of Microelectronics
Key Responsibilities
- Evaluate and develop accurate PDK components using classical methods, multi-physics methods (like reduced order models), and probabilistic methods utilizing applicable AI/ML algorithms or PINN.
- Participate in and perform benchmarks and Design of Experiments using measured tapeout data from test packages (2.5D Interposer, 3D Hybrid Bonding, or 3.5D packages).
- Investigate and expand the use of AI/ML algorithms within the advanced package design flow, including surveying diffusion models, reinforcement learning, PINN, and language models.
- Develop and maintain PDK including installation guides, Design Rule Manuals, automation scripts, and reference flows.
Requirements
- PhD in Electrical or Computer Engineering with 5 years of relevant experience handling various aspects of Process Design Kits (PDK).
- Understanding of advanced packaging, high speed or RF interconnects/I-O PHY, signal/power integrity, thermal flow, package stress, and yield in advanced packaging.
- Experience with multi-physics modelling approaches, machine learning regression, use of language models, or reduced order models.
- Proficiency in programming/scripting using one or more of: SKILL, ADL, Python, Perl, C/C++, TCL, or AEL.