About the role
AI summarisedAs a Lithography Process Engineer at GlobalFoundries, you will be responsible for sustaining, optimizing, and developing photolithography processes within a high-volume manufacturing environment. You will utilize advanced lithography tools and metrology systems to ensure critical dimension control, overlay accuracy, and defect reduction, driving process improvements across the fab operations.
FoundryOnsite
Key Responsibilities
- Monitor and analyze SPC/ESPC charts for lithography modules using SPACE, responding to OOC/OOS events.
- Perform critical dimension (CD) and overlay analysis using CD-SEM, scatterometry, and overlay metrology tools (e.g., KLA, ASML YieldStar).
- Optimize photoresist coating, soft bake, exposure, post-exposure bake (PEB), and development processes.
- Manage and tune stepper/scanner exposure tools (e.g., ASML, Nikon) for optimal performance and tool matching.
- Conduct Design of Experiments (DOE) and split lot analysis using JMP, Klarity ACE, and other statistical tools.
- Troubleshoot lithography defects such as bridging, footing, scumming, and resist residues.
- Drive process improvements to enhance CD uniformity, overlay performance, line edge roughness (LER), and critical dimension uniformity (CDU).
- Support technology transfers, new product introductions (NPI), and process ramp-up activities.
- Lead cross-functional teams to resolve yield excursions and implement corrective/preventive actions (CAPA).
Requirements
- Bachelor Degree in Electrical / Electronics / Mechanical / Mechatronics / Microelectronics Engineering
- 1 to 3 years of relevant experience in semiconductor wafer process engineering
- Proven ability to identify, assess and solve problems
- Ability to perform Normal / Swing Shift (or 12-hour rotating shift if required)