About the role
AI summarisedSenior Metrology Development Engineer responsible for deploying innovative 3D NAND process technologies and X-ray based metrology solutions. The role involves developing metrology models, defining equipment roadmaps, and collaborating across teams to ensure robust process control and successful technology ramps.
IDMOnsiteSTPG
Key Responsibilities
- Own applications and develop processes of new nodes, demonstrating X-ray metrology techniques to enable robust process control
- Identify and provide solutions for inline detection in collaboration with process engineer and process integration, with emphasis on non-destructive X-ray methods for buried or high-aspect-ratio structures
- Identify modeling opportunities using metrology and detection data to explain electrical failed signature at probe, integrating X-ray and SEM data where applicable
- Collaborate with HVM Metro team on technology choices for the upcoming nodes and translate future technology device needs into clear equipment roadmap requirements
- Work closely with the planning team to understand Model-on-record (MOR) impact of new technology and maintain MOR accuracy to enable successful technology ramp
- Influence supplier equipment roadmap to enable new technology development in Micron, specifically driving next-generation X-ray metrology solutions for advanced 3D NAND structures
Requirements
- Bachelor's or Master's degree in Material Science, Physics, or a related field
- Familiarity with X-ray based metrology techniques, materials characterization, and data analysis
- Demonstrated experience in metrology within a semiconductor manufacturing or development environment
- Basic knowledge of operating, troubleshooting and hands-on experience with X-ray metrology tools (e.g., XRF, XRR, XRD, SAXS, X-ray CD, or X-ray imaging systems)
- Strong collaboration and communication skills, with the ability to work in multidisciplinary teams
- Analytical and problem-solving skills, with a focus on continuous improvement
- Experience with semiconductor device fabrication and characterization
- Direct experience applying X-ray metrology to advanced nodes (e.g., high-aspect-ratio features, buried layers, or complex 3D NAND stacks)
- Knowledge of statistical analysis and data interpretation
- Familiarity with data science and machine learning is a plus