About the role
AI summarisedThis is a senior manager/manager role in advanced packaging technology development at a leading semiconductor memory and storage company. The role involves developing and communicating packaging technology strategy, providing technical leadership, leading multi-functional initiatives, and ensuring execution of milestones. The position requires a strong background in semiconductor process engineering, data analytics, and equipment development, with a focus on wafer bonding, plating, and warpage control.
IDMFull-timeHIG
Key Responsibilities
- Develop and communicate Advanced Packaging Technology Development strategic objectives
- Understand the impact and implications of APTD strategy to the overall company strategy and direction
- Set fiscal year technical objectives and insure they are aligned with department objectives
- Demonstrate understanding of technology complexity and effective technology decision making
- Provide technical leadership that may influence company direction
- Represent APTD in providing cross department leadership in area of responsibility
- Work effectively with peers in other department to develop and drive multi-functional initiatives
- Ensure accuracy, quality, and timeliness of results
- Guide best utilization of resources to achieve end results
- Ensure critical work, milestones and goals are met by the team
- Continue to build new skills through development goals and learning events
- Seek out opportunities to work multi-functionally, build a network, and gain competency across domains
Requirements
- B.S/M.S./Ph.D. (or equivalent education) in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or other related technical fields
- 8 or more years of semiconductor process or equipment engineering experience, preferably in wafer bonding, plating, warpage control and packaging field
- Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics
- Experience with Visual Basic for automation and tool integration
- Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control
- Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding
- Experience in equipment development with fundamental understanding of post probe and assembly process and equipment interactions
- Strong understanding of process flows, process interactions, and how process changes can affect yield, performance, and reliability
- Consistent track record to solve problems and address root causes
- Ability to multi-task and manage numerous projects simultaneously
- Tenacity to work effectively under timelines and limited resources