About the role
AI summarisedThe Dry Etch Principal Engineer/MTS Lead will lead a next-generation NAND R&D dry etch team, responsible for developing process technology, managing projects, driving yield improvements, and mentoring direct reports. This role requires deep expertise in plasma dry etch, high aspect ratio etching, and collaboration across process integration, manufacturing, and equipment teams. The position involves strategic planning, performance management, and technical leadership in a semiconductor R&D environment.
IDMOnsiteSTPG
Key Responsibilities
- Manage efforts and set the strategy for developing process technology for assigned products in Process R&D
- Offer routine project coordination and technical support to your process development team
- Handle the demands of several customers to determine priorities for your team
- Resolve yield and defect issues related to your process area
- Collaborate with the Manufacturing Development Engineering team to meet R&D product quality and cycle time goals
- Work with R&D Management, Process Integration, and High-Volume Manufacturing Sites to regularly align on project requirements, priorities, and timelines
- Engage manufacturing sites, Manufacturing Integration, and Central Teams to provide technical direction and maintain alignment between production and R&D
- Drive ongoing process and operational efficiency improvements to meet the needs of PI and manufacturing by actively interacting with the equipment development team and suppliers
- Interact with equipment and chemical vendors to ensure alignment and timely progress on our roadmaps, as well as foster a positive relationship
- Partner with direct reports to develop long/short-term goals and projects that meet the needs of the Technology Development department
- Offer ongoing feedback to your team members on performance, establishing a career plan and mentoring your team members to encourage their professional development
- Set and communicate performance goals for the team, and lead goal-based performance evaluations for all team members
Requirements
- At least five years of experience leading a process development team in a semiconductor R&D or high-volume manufacturing environment
- Comprehensive understanding of Plasma Dry Etch Technology
- Knowledge and experience in high aspect ratio etch development
- Demonstration of collaborative ways of problem solving
- Understand hard mask requirements based on material properties
- Positive relationship building skills, both with internal and external customers
- Demonstrated structured problem-solving capabilities
- Strong communication and interpersonal skills (written, verbal, and presentation)
- Experience in being a mentor to manage the performance of direct reports
- Ability to seek opportunities for continuous improvement, as a team member, leader, and for the organization
- PhD or Masters in Physics, Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, along with at least 8 years of experience in the semiconductor industry concentrating on dry etch technology and managing personnel
- Bachelor's degree in Physics, Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, along with at least 15 years of experience in the semiconductor sector concentrating on Dry Etch technology and managing personnel