Micron Technology

Principal Engineer Advanced Package Technology Development

Micron Technology
Integrated Device ManufacturingSingapore, SingaporeFull-time2 weeks ago

About the role

AI summarised

Principal Engineer in Advanced Package Technology Development at Micron, a semiconductor memory leader. The role focuses on developing differentiated packaging solutions, driving technical innovation, and collaborating across teams to advance memory integration technologies like HBM and 3D stacking.

IDMFull-timeHIG

Key Responsibilities

  • Deliver high-value, differentiated technology solutions by finding opportunities and driving technical innovation to provide business value.
  • Collaborate continuously with internal and external partners to ensure seamless technology integration.
  • Consult and influence technical and strategic decisions at senior management levels.
  • Lead multi-disciplinary technical teams and task forces to achieve strategic goals.
  • Maintain effective communication with collaborators.
  • Analyze and understand competitive trends to improve Micron's competitive edge.
  • Participate actively in technology events, contributing to industry knowledge.
  • Guide the development of packaging technology roadmaps.
  • Assess competitive metrics through data intelligence for strategic advantage.
  • Define requirements with proven technical data and content.
  • Demonstrate profound technical expertise to develop new technologies and guide others.
  • Build an extensive technical network across various domains.

Requirements

  • Over 5 years of professional experience in semiconductor advanced packaging.
  • BS, MS, or Ph.D. in Material Science, Electrical, Chemical, Mechanical Engineering, Physics, or related field, or equivalent experience.
  • Deep knowledge of High Bandwidth Memory, 2.5D integration, and emerging 3D integration strategies including Hybrid bonding (Required).
  • Hands-on process module engineering experience in Wafer Level Packaging or 3D stacking process (Required).
  • Experience in DRAM manufacturing and OSAT companies (Required).
  • Understanding of DRAM wafer structure and process flows (Highly Preferred).
  • Proficient in English, with additional language skills in East Asian languages being highly preferred.
  • A passion for innovation demonstrated by patent inventions or published literature!