About the role
AI summarisedStaff/Principal Engineer for NAND Technology Development (TD) RDA at Micron, a semiconductor memory company. Responsible for owning site-level RDA strategy, leading defect analysis, and driving continuous improvement in inspection and yield learning.
IDMFull-timeSTPG
Key Responsibilities
- Own the site-level RDA strategy and annual roadmap aligned to NAND TD technology nodes.
- Lead analysis of experimental and production flows to detect, classify, and trend systematic and random defects.
- Establish, track, and report program health metrics (baseline health, detection rates, false positives, MTTR).
- Direct fast containment for defect excursions: trigger tool quarantines, define hold criteria, and lead 8D corrective actions.
- Architect inspection recipes and sampling strategies; optimize sensitivity, throughput, and cost of ownership.
- Partner with Process Integration, Yield, and Data Science to correlate inspection signals to device performance and yield.
- Influence supplier roadmaps; evaluate, qualify, and release next‑gen optical/e-beam inspection capabilities.
- Standardize and disseminate Best Known Methods (BKM) across global TD and manufacturing sites.
- Mentor, coach, and upskill engineers; develop succession plans and technical ladders within the RDA domain.
- Champion safety and continuous improvement (CIP); drive kaizen/lean initiatives that improve cycle time and learning velocity.
Requirements
- Bachelor's degree with 7+ years relevant semiconductor experience, or Master's/PhD with 5+ years.
- Minimum 3+ years hands-on RDA experience in semiconductor manufacturing or equipment engineering.
- Demonstrated expertise in defect inspection, process monitoring, and yield learning.