About the role
AI summarisedSenior Thin Film Process Engineer at STMicroelectronics, a global semiconductor company. Responsible for owning the ECP copper process on LAM Novellus SABRE tools, driving process development, sustaining activities, and collaborating with cross-functional teams to improve yield and tool performance.
IDMFull-timeProcess Engineering
Key Responsibilities
- Develop, optimize, and sustain ECP Cu reinforcement / damascene fill processes on Novellus SABRE tools.
- Define and tune recipes and hardware configurations to achieve target thickness, uniformity, fill performance, and defect levels.
- Collaborate with PVD barrier/seed and integration teams to ensure strong linkage between upstream processes (Ti, TiN, CVD‑TiN, Cu seed, etc.) and downstream ECP performance.
- Perform structured hardware and process characterization, including experiments on flow, contact design, waveform, and chemistry conditions.
- Lead troubleshooting and excursion management, conduct systematic root‑cause analysis, and implement permanent corrective and preventive actions.
Requirements
- Bachelor's or Master's degree in Electrical/Electronic Engineering, Microelectronics, Materials Science, Applied Physics, Chemical or Mechanical Engineering, or a related discipline.
- 3+ years of hands‑on experience with ECP copper processes on LAM Novellus SABRE systems in a semiconductor fab environment.
- Solid knowledge of semiconductor manufacturing, vacuum technology, and thin‑film deposition, including PVD barrier/seed fundamentals.
- Strong collaboration and communication skills: able to document and present findings clearly through technical reports, reviews, and data summaries; active participation in cross‑functional forums and project teams.
- Proven problem‑solving capability, including advanced root‑cause analysis, failure‑mode identification, and implementation of robust, sustainable solutions.