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Micron Technology

Principal/Senior Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering

Micron Technology
Integrated Device ManufacturingSingapore, SingaporeFull-time7 months ago
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About the role

AI summarised

Principal/Senior Engineer in Advanced Packaging Die Level Technology Engineering at Micron, a semiconductor memory and storage company. The role focuses on developing and enabling assembly processes for advanced packaging technologies like wafer-level packaging and die stacking, with responsibilities spanning process development, equipment and materials evaluation, quality improvement, and cross-functional collaboration.

IDMFull-timeHIG

Key Responsibilities

  • Develop and optimize assembly processes for advanced packaging technologies, including wafer-level packaging and die stacking Chip on Wafer, Chip to Wafer.
  • Focus on improving product quality, driving yield improvements, reducing costs, and enhancing productivity.
  • Establish and improve process management projects to deliver technology node requirements.
  • Evaluate and promote new equipment and materials to enhance process capabilities.
  • Set up process parameters for a variety of semiconductor equipment.
  • Evaluate, promote, and plan for new equipment and materials.
  • Ensure defense coverage through process, measurement, inspection, and testing.
  • Establish correlations between defense mechanisms to identify improvement opportunities.
  • Conduct continuous data analysis to establish advanced controls and identify improvement opportunities.
  • Work closely with internal and external stakeholders to build and execute technology development strategies aligned with organizational and business objectives.
  • Work closely with various teams, including Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control.
  • Ensure smooth transition from new product development, qualification, small volume production to high volume production.

Requirements

  • B.S/M.S./Ph.D. (or equivalent education) in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or other related technical fields.
  • 2 or more years of semiconductor process development or equipment evaluation in semiconductor, preferably in wafer bonding, die stacking and packaging field.
  • Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics.
  • Experience with Visual Basic for automation and tool integration.
  • Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control.
  • Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding.
  • Strong understanding of process flows, process interactions, and how process changes can affect yield, performance, and reliability.
  • Tenacity to work effectively under timelines and limited resources.
  • Consistent track record to solve problems and address root causes.