About the role
AI summarisedOwn the end-to-end facet coating process for laser devices, driving productivity, yield, quality, and reliability across internal lines and subcontractor facilities. This role serves as the technical authority for coatings, managing capacity expansion through new coater buyoff and ensuring seamless transition from R&D to High-Volume Manufacturing (HVM).
FablessOnsite
Key Responsibilities
- Lead technical management for facet coating and backend operations, including wafer scribing, laser bar handling, and AVI.
- Design complex multilayer interference coatings (AR, HR, passivation) and optimize deposition recipes using IBS.
- Manage global subcontractor manufacturers, implementing remote monitoring to ensure consistent coating process performance.
- Drive New Process Integration (NPI) and formal process transfers from design phase through to HVM.
- Perform deep-dive root cause analysis and implement robust Corrective and Preventive Actions (CAPA) for process excursions.
- Define comprehensive process control plans, SPC strategies, FMEA, and OCAP execution.
- Utilize statistical data analysis to identify yield detractors related to coating, thickness, and defects.
- Establish dashboards and KPIs to track facet coating process health, monitoring cycle time and flagging critical issues.
Requirements
- Bachelor’s or Master’s in Engineering (Physics, Materials Science, Optical, Chemical, or Electrical).
- 5–15 years of experience in semiconductor wafer fab or backend processes.
- At least 5 years of hands-on experience in thin-film deposition specifically for optoelectronic devices.
- Understanding of vacuum physics and deposition techniques (IBS, ALD).
- Strong knowledge of laser manufacturing principles (DFB, EML & VCSEL) using InP or GaAs materials.
- Proficiency in SPC, DOE, FMEA, DMAIC, and advanced statistical tools.
- Experience with automated bar-handling, wafer scribing/cleaving, Pick-and-Place (PnP), and AVI tools.