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Micron Technology

Package Characterization Lab Manager, APTD

Micron Technology
Integrated Device ManufacturingSingapore, SingaporeFull-time1 weeks ago
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About the role

AI summarised

Manage a package characterization lab within Micron's Advanced Packaging Technology Development (APTD) team, leading shift engineers and technicians to deliver failure analysis and characterization support for advanced packaging technologies. Responsible for lab operations, technical leadership, workforce development, and cross-functional collaboration to ensure high-quality, timely results.

IDMFull-timeHIG

Key Responsibilities

  • Lead Package Characterization lab operations to meet key performance metrics, cycle-time and safety standards.
  • Plan and optimize FA lab equipment, space, and budget to support current and future needs with high utilization efficiency.
  • Coordinate timely equipment calibration (external vendors), repairs, and spare parts procurement to ensure sustained equipment uptime.
  • Evaluate and introduce new FA tool models and capabilities in partnership with vendors and Micron subject‑matter experts.
  • Lead various EHS, quality, TS, ISO14001, OHSAS, and customer audits with a strong safety‑first culture.
  • Provide technical mentorship and drive continuous improvement of package characterization methodologies and procedures.
  • Collaborate cross‑site to benchmark, standardize best-known methods to improve lab efficiency and effectiveness.
  • Ensure FA lab readiness for new product designs and technologies.
  • Align task priorities and execution with APTD team members, providing recommendations for optimal lab tool/resource usage.
  • Deliver timely, clear, and actionable package analysis insights to enable data‑driven technical and business decisions.
  • Build and sustain a robust training and development program, including hands‑on FA casework, cross‑site learning, and leadership mentoring.
  • Define, track, and review performance metrics to identify gaps, drive accountability, and build a high‑performing team.

Requirements

  • Bachelor's degree or higher (Master's/PhD preferred) in Materials Science, Physics, Chemistry, or related field.
  • 8+ years of experience in semiconductor package characterization (physical/thermal/chemical) and failure analysis field.
  • Knowledge of package FA tools and techniques including SEM, EDX, FIB, TEM, AFM, FTIR, XPS, X‑ray, CSAM, ion milling, delayering, and decapsulation.
  • Knowledge of semiconductor or advanced packaging manufacturing processes.
  • Experience in lab management, shift resource planning, and budgeting.
  • Proven technical leadership and people management capability.
  • Strong written and verbal communication skills with a customer‑focused mentality.