Jobfoundry
Jobfoundry
Micron Technology

Staff/Principal Engineer - CMP Advanced NAND

Micron Technology
Integrated Device ManufacturingSingapore, SingaporeFull-time3 months ago
Apply Now

About the role

AI summarised

Staff/Principal Engineer for CMP process development in advanced NAND R&D at Micron Technology in Singapore. The role focuses on developing and optimizing chemical mechanical planarization processes for next-generation 3D NAND memory, involving fundamental research, consumables development, hardware evaluation, and collaboration with global teams.

IDMFull-timeGeneral

Key Responsibilities

  • Develop and optimize chemical mechanical planarization procedures to improve product quality and reliability for next-generation memory parts.
  • Focus on understanding and improving process margins required for meeting mature yield goals for 3D NAND parts.
  • Advanced 3D NAND CMP process development including performing fundamental research, consumables development, hardware evaluation, and testing processes for novel applications.
  • Initiate and manage experiments to widen process margins and evaluate manufacturability of next node solutions.
  • Extensively collaborate with vendors to develop processes that meet integration requirements for current and next-generation 3D NAND nodes.
  • Incorporate best known manufacturing methods into early development phase of upcoming nodes.
  • Design and implement advanced process monitoring and control methodologies.
  • Provide strategic roadmap for N+, N++ and future NAND Nodes.
  • Serve as a technical expert contributing to technical projects for improvements to processes, procedures, and equipment.
  • Define and lead complex, multi-functional projects of critical importance; help define strategic direction.
  • Provide advice and counsel to management on significant technical issues; lead and initiate innovation projects through patents/technical papers.
  • Mentor new hires and less experienced team members on CMP fundamentals, process development, and Micron systems.

Requirements

  • Masters/PhD with 5-10 years or Bachelors degree with 7-12 years of relevant working experience in the semiconductor industry with a background in Chemical Mechanical Planarization (CMP) Process in 300mm wafer fabrication.
  • Hands-on experience with CMP equipment operation such as AMAT (LKP), EBARA-300X and next generation CMP equipment, optical metrology, profilometry, polishing slurries, conditioners, and polishing pads.
  • Experience in dielectrics/metals CMP process development on 3D NAND or other memory technology.
  • Understanding of various integration and structural impacts and constraints related to film deposition and other upstream/downstream processes.
  • Excellent oral and written communication skills with ability to convey the message in concise and effective manner both locally and remotely.
  • Strong collaboration and communication skills (verbal and written).
  • Self-driven, adaptable, and able to manage multiple projects.
  • Proven ability to take calculated risks and execute novel solutions.
  • Recognized as a mentor, team player and technical expert with ability to solicit feedback, accept input, and analyze success/failure.
  • An understanding of the general process steps and process flow for memory processing planar and vertical NAND memory (preferred).
  • Strong interest in Data science, modelling, and drive to use/adopt AI to optimize workflows (preferred).