About the role
AI summarisedMicron is seeking an intern to join the Assembly Process Engineering team, focusing on Flip Chip Attach and Underfill processes in semiconductor packaging. The intern will conduct experiments, analyze data using statistical and AI methods, collaborate on yield improvement initiatives, and deliver a final presentation on findings and recommendations.
IDMOnsiteAssembly & Test
Key Responsibilities
- Setup, execute, and analysis of Flip Chip Attach and Underfill process experiments
- Collaborate with cross-functional teams to troubleshoot and resolve process issues and work on engineering projects
- Apply statistical methods to analyze process data and identify trends or anomalies
- Explore AI-based approaches for predictive modeling and process optimization
- Deliver a final presentation summarizing key learnings, challenges, and recommendations
- Contribute to at least one yield improvement or defect reduction initiative
- Develop a simple AI model or script to support process monitoring or defect prediction
Requirements
- Degree in Mechanical/Chemical/Material Science Engineering
- Internship availability from January to May 2026