About the role
AI summarisedResearch scientists are responsible for developing, optimizing, and integrating advanced wafer-to-wafer (W2W) bonding techniques crucial for next-generation semiconductor applications like 2.5D and 3D IC packaging.
ResearchOnsiteInstitute of Microelectronics
Key Responsibilities
- Lead the design and development of innovative W2W bonding techniques for high-performance computing, AI, and memory applications.
- Optimize critical bonding parameters including temperature, pressure, and surface preparation methods to achieve high yield and alignment accuracy.
- Address process integration challenges such as wafer warpage, thermal budget constraints, contamination, and thermo-mechanical stress reduction.
- Conduct comprehensive evaluations of new processes, materials, and equipment through reliability testing (electrical, thermal, mechanical).
- Utilize metrology tools and data analysis to assess surface topography, void defects, and bond quality, driving process improvements.
- Conceive, plan, and lead high-impact projects involving external partners and stakeholders.
- Collaborate on defining future technology roadmaps for advanced packaging solutions.
Requirements
- PhD degree in Materials Science, Mechanical Engineering, Physics, Chemistry, Electronics, or Electrical Engineering.