About the role
AI summarisedThis role at DSO National Laboratories involves executing microelectronics assembly tasks such as die attachment and wire-bonding. The engineer will also perform design for manufacturing checks on PCB layouts and collaborate with external vendors to oversee board fabrication for defense R&D projects.
Defense R&DOnsiteAccounting
Key Responsibilities
- Conduct microelectronics assembly tasks such as die attachment and wire-bonding
- Perform design for manufacturing and assembly checks on PCB designs
- Coordinate with PCB vendors to oversee the fabrication of printed circuit boards
Requirements
- Diploma/ Bachelor’s Degree in Electrical / Electronic Engineering / Electrical and Electronic Engineering
- Proficient in microelectronics assembly
- Certified in IPC-610C and J-Std-001, or familiar with IPC standards
- Experienced in soldering processes, including through-hole and surface mount soldering / rework
- Self-motivated, independent, and committed to project schedules
- Fresh graduates are welcome to apply