Micron Technology

Senior Engineer, Process Integration, NAND NTI

Micron Technology
Integrated Device ManufacturingSingapore, SingaporeFull-time1 months ago

About the role

AI summarised

Senior NAND Module Process Integration Engineer at Micron Technology's Singapore R&D department, responsible for designing and integrating process solutions to improve 3D NAND product yield and quality. Leads cross-functional teams, develops CSPEC criteria, coordinates manufacturing activities, and transfers new technology from R&D to manufacturing.

IDMFull-timeSTPG

Key Responsibilities

  • Identify and quantify key module deficiencies and technology gaps. Lead cross-functional teams to address these issues. Improve current process flows and develop innovative solutions to meet product requirements and manufacturability.
  • Develop or redefine CSPEC criteria for optimal product performance and drive activities to ensure manufacturing process capability.
  • Coordinate activities at the manufacturing site to secure funding for experiments, and conversions, and optimally communicate decisions to relevant R&D, Product Engineering, and Manufacturing partners.
  • Undertake development projects to evaluate and implement new integration schemes for alpha and derivative part types. Establish proof of concept for future tech nodes at the manufacturing facility.
  • Take on a leadership role at quarterly yield summits and monthly program reviews to summarize complex problems, explain actions taken to address them, and align R&D, Manufacturing, and senior management teams.
  • Assist in the transfer of new technology from R&D to manufacturing. Contribute to ensuring a successful ramp-up and qualification. Support the transfer, documentation, and training of module fundamentals into manufacturing.

Requirements

  • Passionate about semiconductor technology and innovation.
  • Adept at data analysis, problem-solving, and process integration optimization.
  • Excellent communication skills and ability to work in cross-functional teams.
  • PhD in Material Science, Electrical Engineering, Microelectronics, Chemical or Physics Engineering, or a related field.
  • 2 years of experience in the semiconductor industry is an advantage.
  • Proficiency in data analysis, visualization or simulation software, such as JMP, Tableau is desirable.
  • Ability to develop a strong holistic end-to-end understanding of PI modules on new NAND technologies and related structural & electrical fail mechanisms.
  • In-depth knowledge and direct experience with non-volatile memories (NAND) along with good understanding of the NAND process flow, the interaction of process & device, common yield & reliability issues are desirable.
  • Experience in semiconductor R&D product life cycle from design to manufacturing is desirable.
  • Ability to be self-motivated, and self-governing with proven ability to work in a demanding & dynamic environment.
  • Display Micron Value of People. Innovation, Tenacity, Collaboration and Customer Focus.