About the role
AI summarisedLead process development, optimization, and transfer to manufacturing to achieve yield, quality, cost, and reliability targets in a semiconductor fabrication environment.
FablessOnsite
Key Responsibilities
- Own and drive advanced process modules (e.g., lithography, wet/dry etch, metal/passivation deposition, wafer thinning).
- Lead yield improvement and defect reduction initiatives using statistical and DOE methodologies.
- Drive new process integration (NPI) and process transfer to high-volume manufacturing.
- Perform root cause analysis and implement robust corrective/preventive actions.
- Define process control plans, SPC strategies, and OCAP execution.
- Collaborate cross-functionally with equipment, integration, quality, and R&D teams.
- Mentor junior engineers and technicians.
- Interface with suppliers on process and material improvements.
Requirements
- Bachelor’s or Master’s degree in Engineering (Electrical, Chemical, Materials, or related).
- 8–12 years of semiconductor wafer fab process experience.
- Strong knowledge of SPC, DOE, FMEA, and statistical data analysis tools.
- Demonstrated leadership in cross-functional technical projects.
- Strong analytical, problem-solving, and communication skills.