About the role
AI summarisedThis senior-level role focuses on technical leadership for NAND flash memory Test Chip Vehicles (TCV). The engineer will oversee the entire learning loop from pre-silicon simulation and regression strategy to silicon bring-up, debug, and characterization to drive design and methodology improvements for next-generation products.
IDMOnsiteSTPG
Key Responsibilities
- Own pre-silicon validation strategy for TCV, partnering with Design, Process, and TD to define what must be proven in simulation versus silicon.
- Develop, maintain, and execute robust simulation and regression frameworks (functional, parametric, stress, and corner) aligned to TCV objectives.
- Define coverage expectations and exit criteria for pre-silicon regressions, identifying gaps and latent risks early.
- Analyze simulation results to surface architecture, device, and margin sensitivities, driving design updates and tape-out readiness decisions.
- Provide technical ownership for TCV bring-up from first silicon through full characterization readiness.
- Define probe enablement, trims, operating conditions, and debug strategies to accelerate stable and informative silicon access.
- Lead execution of electrical characterization plans validating array, periphery and experimental features against design and process intent.
- Architect TCV specific test modes, patterns, and flows to maximize learning efficiency and data quality.
- Partner with Test Solutions Engineering (TSE) to influence probe architecture and infrastructure supporting TCV for protocol evolution.
- Spearhead AI adoption to perform advanced data analytics across large simulation and silicon datasets.
Requirements
- Bachelor’s or post-graduate degree in Electrical/ Electronics/ Computer Engineering or related field.
- Minimum 5 years of relevant industrial experience.
- Strong fundamentals in CMOS/ MOSFET device physics, memory circuits, and semiconductor devices.
- Demonstrated experience owning pre-silicon simulation/regression and post-silicon test/ validation for complex designs.
- Strong capability in data analysis and scripting (Python, JMP, or equivalent) applied to large datasets.
- Proven ability to drive ambiguous technical problems to closure with minimal supervision.
- Deep experience with NAND Flash architectures, array/periphery interactions, and test chips is preferred.
- Working knowledge of DFT, probe test infrastructure, and failure analysis.
- Experience with firmware-assisted test modes and experimental silicon features.
- Exposure to automation, ML/AI, or advanced analytics applied to simulation and silicon learning loops.
- Candidates may be considered for higher job grades if they exceed 10 years of relevant experience.
